Silicone adhesive three curing mechanisms

Silicone adhesive three curing mechanisms

What is the silicon adhesive curing mechanism?

Silicone adhesive three curing mechanisms: silicone adhesive according to the curing mechanism can be divided into: heating curing type (hot curing glue), room temperature curing RTV silicone glue (condensation type) and addition reaction adhesive three categories.

Curing mechanism of heating vulcanized silicone adhesive:

The core material of cl-24/26ab silica gel adhesive is polysiloxane with high molecular weight and peroxide is used as cross-linking agent.

The mechanism is the radical cross-linking reaction induced by peroxides.

Typically employed to solid or liquid silicone rubber and metal, plastic material forming.

Curing mechanism of RTV silicone adhesive:

Low molecular weight polysiloxane was utilized to seal the hydroxyl group.

Can be separated into a single component of silicone adhesive and two components of silicone adhesive.

Curing mechanism of one-component room temperature vulcanized silica gel kn-300: the hydroxyl group in the blue meets the hydro-gas in the air to be vulcanized and formed, hydrolyzes to the unstable hydroxyl group, and then condenses with the cross-linking agent.

Different cross-linking agents can be divided into the following four types:

(1) diabetic acid type: KANGLIBNAG kn-300n, kn-300x

(2) dioxide type: kn-300a, kn-300t and kn-300b /H

(3) dealcoholization type

(4) decision type

Curing mechanism of two-component RTV silica gel adhesive:

Mechanism of condensed silica gel adhesive: hydroxyl in silica gel adhesive is formed by condensation reaction of alkoxy group on catalyst (organotin salt, such as tin dibutyllaurate, stannous oxalate, etc.) and cross-linking agent (alkoxy silane, such as ethyl orthosilicate or its partial hydrolysate).

Dealcoholization is the most common type.

Pressure-sensitive adhesive curing mechanism of molded silica gel:

Kl-6634 / kl-6638 is linked by a platinum catalyst.

There are no byproducts in the curing process, but it is not difficult to poison the catalyst, so it is necessary to avoid contact with N, S, P and other elements.

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